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TNPU12061K32BYEN00 Datasheet(PDF) 3 Page - Vishay Siliconix |
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TNPU12061K32BYEN00 Datasheet(HTML) 3 Page - Vishay Siliconix |
3 / 7 page www.vishay.com For technical questions, contact: thinfilmchip@vishay.com Document Number: 28779 316 Revision: 12-Aug-10 TNPU e3 Vishay Draloric High Precision Thin Film Chip Resistors ± 0.05 %; ± 5 ppm/K DESCRIPTION Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A homogeneous film of metal alloy is deposited on a high grade AI2O3 ceramic substrate and conditioned to achieve the desired temperature coefficient. Specially designed inner contacts are deposited on both sides. A special laser is used to achieve the target value by smoothly fine trimming the resistive layer without damaging the ceramics. A further conditioning is applied in order to stabilize the trimming result. The resistor elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure tin on nickel plating. The result of the determined production is verified by an extensive testing procedure on 100 % of the individual chip resistors. Only accepted products are laid directly into the tape in accordance with IEC 60286-3 (3). ASSEMBLY The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow or vapour phase as shown in IEC 61760-1. The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system. The resistors are RoHS compliant, the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. The immunity of the plating against tin whisker growth has been proven under extensive testing. All products comply with the GADSL (1) and the CEFIC-EECA-EICTA (2) list of legal restrictions on hazardous substances. This includes full compliance with the following directives: • 2000/53/EC End of Vehicle life Directive (ELV) and Annex II (ELV II) • 2002/95/EC Restriction of the use of Hazardous Substances Directive (RoHS) • 2002/96/EC Waste Electrical and Electronic Equipment Directive (WEEE) Solderability is specified for 2 years after production or re-qualification. The permitted storage time is 20 years. Notes (1) Global Automotive Declarable Substance List, see www.gadsl.org. (2) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade organisation representing the information and communications technology and consumer electronics), see www.eicta.org → issue → environment policy → chemicals → chemicals for electronics. (3) The quoted IEC standards are also released as EN standards with the same number and identical contents. PACKAGING MODEL TAPE WIDTH [mm] PITCH [mm] REEL DIAMETER [mm/inch] PIECES PER REEL PACKAGING CODE FOR PRODUCT DESCRIPTION PACKAGING CODE FOR PART NUMBER TYPE OF CARRIER TAPE TNPU0603 e3 TNPU0805 e3 TNPU1206 e3 8 4 180/7 1000 E52 EN Paper 5000 ET1 EA |
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