Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications

Thermal Resistances

Part #

Symbol

Parameter

Value

Unit

P500-G

Junction to leads (package)

113

°C/W

236

°C/W

P850-G

Junction to leads (package)

119

°C/W

215

°C/W

Reflow Profile

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp)

3 °C/sec. max.

Preheat

- Temperature Min. (Tsmin)

- Temperature Max. (Tsmax)

- Time (tsmin to tsmax)

150 °C

200 °C

60-180 sec.

Time maintained above:

- Temperature (TL)

- Time (tL)

217 °C

60-150 sec.

Peak/Classification Temperature (Tp)

260 °C

Time within 5 °C of Actual Peak Temp. (tp)

20-40 sec.

Ramp-Down Rate

6 °C/sec. max.

Time 25 °C to Peak Temperature

8 min. max.