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BAS40 Datasheet(PDF) 1 Page - Diodes Incorporated |
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BAS40 Datasheet(HTML) 1 Page - Diodes Incorporated |
1 / 3 page BAS40 /-04 /-05 /-06 SURFACE MOUNT SCHOTTKY BARRIER DIODE Features • Low Forward Voltage Drop • Fast Switching • PN Junction Guard Ring for Transient and ESD Protection • Lead, Halogen and Antimony Free, RoHS Compliant "Green" Device (Notes 3 and 4) • Qualified to AEC-Q101 Standards for High Reliability Mechanical Data • Case: SOT-23 • Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020D • Terminals: Solderable per MIL-STD-202, Method 208 • Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe). • Polarity: See Diagrams Below • Marking Information: See Page 2 • Ordering Information: See Page 2 • Weight: 0.008 grams (approximate) Top View BAS40 BAS40-04 BAS40-05 BAS40-06 Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 40 V Forward Continuous Current (Note 1) IFM 200 mA Forward Surge Current (Note 1) @ t < 1.0s IFSM 600 mA Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 1) PD 350 mW Thermal Resistance, Junction to Ambient Air (Note 1) RθJA 357 °C/W Operating Temperature Range TJ -55 to +125 °C Storage Temperature Range TSTG -65 to +150 °C Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Min Typ Max Unit Test Condition Reverse Breakdown Voltage (Note 2) V(BR)R 40 ⎯ ⎯ V IR = 10μA Forward Voltage VF ⎯ ⎯ 380 1000 mV tp < 300μs, IF = 1.0mA tp < 300μs, IF = 40mA Reverse Leakage Current (Note 2) IR ⎯ 20 200 nA tp < 300μs, VR = 30V Total Capacitance CT ⎯ 4.0 5.0 pF VR = 0V, f =1.0MHz Reverse Recovery Time trr ⎯ ⎯ 5.0 ns IF = IR = 10mA to IR = 1.0mA, RL = 100Ω Notes: 1. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 2. Short duration pulse test used to minimize self-heating effect. 3. No purposefully added lead. Halogen and Antimony Free. 4. Product manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. BAS40 /-04 /-05 /-06 Document number: DS11006 Rev. 21 - 2 1 of 3 www.diodes.com July 2008 © Diodes Incorporated Please click here to visit our online spice models database. |
Similar Part No. - BAS40_08 |
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Similar Description - BAS40_08 |
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