iC-MFL / iC-MFLT

8-/12-FOLD FAIL-SAFE LOGIC N-FET DRIVER

Rev C1, Page 3/13

PIN CONFIGURATION QFN24

4 mm x 4 mm to JEDEC MO220

PIN FUNCTIONS

No. Name Function

1 OUT1 5 V Output channel 1

2 -

(n.c.)

3 -

(n.c.)

4 GNDR Ground (Resistor)

5 VCC

5 V Supply Voltage

6 IN1

Input channel 1

7 IN2

Input channel 2

8 IN3

Input channel 3

9 IN4

Input channel 4

10 IN5

Input channel 5

11 IN6

Input channel 6

12 IN7

Input channel 7

13 IN8

Input channel 8

14 -

(n.c.)

15 EN

Enable Input

16 -

(n.c.)

17 GND

Ground

18 OUT8 5 V Output channel 8

19 OUT7 5 V Output channel 7

20 OUT6 5 V Output channel 6

21 OUT5 5 V Output channel 5

22 OUT4 5 V Output channel 4

23 OUT3 5 V Output channel 3

24 OUT2 5 V Output channel 2

TP

Thermal-Pad

The Thermal Pad is to be connected to a ground plane on the PCB. Connections between GND, GNDR and the

ground plane should be conciled to system FMEA aspects.