MCM63F737K

•MCM63F819K

10

MOTOROLA FAST SRAM

WRITE TRUTH TABLE

Cycle Type

SGW

SW

SBa

SBb

SBc

(See Note 1)

SBd

(See Note 1)

Read

H

H

X

X

X

X

Read

H

L

H

H

H

H

Write Byte a

H

L

L

H

H

H

Write Byte b

H

L

H

L

H

H

Write Byte c (See Note 1)

H

L

H

H

L

H

Write Byte d (See Note 1)

H

L

H

H

H

L

Write All Bytes

H

L

L

L

L

L

Write All Bytes

L

X

X

X

X

X

NOTE:

1. Valid Only for MCM63F737K.

Rating

Symbol

Value

Unit

Notes

Power Supply Voltage

VDD

VSS – 0.5 to 4.6

V

I/O Supply Voltage

VDDQ

VSS – 0.5 to VDD

V

Input Voltage Relative to VSS for

Any Pin Except VDD

Vin, Vout

VSS – 0.5 to

VDD + 0.5

V

Input Voltage (Three–State I/O)

VIT

VSS – 0.5 to

VDDQ + 0.5

V

Output Current (per I/O)

Iout

±20

mA

Package Power Dissipation

PD

1.6

W

2

Temperature Under Bias

Tbias

–10 to 85

°C

Storage Temperature

Tstg

–55 to 125

°C

NOTES:

1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are

exceeded. Functional operation should be restricted to RECOMMENDED OPER-

ATING CONDITIONS. Exposure to higher than recommended voltages for extended

periods of time could affect device reliability.

2. Power dissipation capability is dependent upon package characteristics and use

environment. See Package Thermal Characteristics.

PACKAGE THERMAL CHARACTERISTICS

Rating

Symbol

Max

Unit

Notes

TQFP

Junction to Ambient (@ 200 lfm)

Single–Layer Board

Four–Layer Board

R

θJA

40

25

°C/W

1, 2

Junction to Board (Bottom)

R

θJB

17

°C/W

3

Junction to Case (Top)

R

θJC

9

°C/W

4

PBGA

Junction to Ambient (@ 200 lfm)

Single–Layer Board

Four–Layer Board

R

θJA

38

22

°C/W

1, 2

Junction to Board (Bottom)

R

θJB

14

°C/W

3

Junction to Case (Top)

R

θJC

5

°C/W

4

NOTES:

1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient

temperature, air flow, board population, and board thermal resistance.

2. Per SEMI G38–87.

3. Indicates the average thermal resistance between the die and the printed circuit board.

4. Indicates the average thermal resistance between the die and the case top surface via the cold plate method (MIL SPEC–883 Method 1012.1).

This device contains circuitry to protect the

inputs against damage due to high static volt-

ages or electric fields; however, it is advised

that normal precautions be taken to avoid

application of any voltage higher than maxi-

mum rated voltages to this high–impedance

circuit.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com