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MC34911BAC Datasheet(PDF) 8 Page - Freescale Semiconductor, Inc |
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MC34911BAC Datasheet(HTML) 8 Page - Freescale Semiconductor, Inc |
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8 / 92 page  Analog Integrated Circuit Device Data 8 Freescale Semiconductor 33911 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS MC33911G5AC/MC3433911G5AC ESD Capability AECQ100 Human Body Model - JESD22/A114 (CZAP = 100 pF, RZAP = 1500 Ω) LIN Pin L1 and L2 all other Pins Charge Device Model - JESD22/C101 (CZAP = 4.0 pF) Corner Pins (Pins 1, 8, 9, 16, 17, 24, 25 and 32) All other Pins (Pins 2-7, 10-15, 18-23, 26-31) According to LIN Conformance Test Specification / LIN EMC Test Specification, August 2004 (CZAP = 150 pF, RZAP = 330 Ω) Contact Discharge, Unpowered LIN pin with 220 pF LIN pin without capacitor VS1/VS2 (100 nF to ground) Lx inputs (33 k Ω serial resistor) According to IEC 61000-4-2 (CZAP = 150 pF, RZAP = 330 Ω) Unpowered LIN pin with 220 pF and without capacitor VS1/VS2 (100 nF to ground) Lx inputs (33 k Ω serial resistor) VESD1-1 VESD1-2 VESD1-3 VESD2-1 VESD2-2 VESD3-1 VESD3-2 VESD3-3 VESD3-4 VESD4-1 VESD4-2 VESD4-3 ±8.0k ±6.0k ±2000 ±750 ±500 ±20k ±11k >±12k ±6000 ±8000 ±8000 ±8000 V THERMAL RATINGS Operating Ambient Temperature (7) 33911 34911 TA -40 to 125 -40 to 85 °C Operating Junction Temperature TJ -40 to 150 °C Storage Temperature TSTG -55 to 150 °C Thermal Resistance, Junction to Ambient Natural Convection, Single Layer board (1s)(7), (8) Natural Convection, Four Layer board (2s2p)(7), (9) RθJA 85 56 °C/W Thermal Resistance, Junction to Case(10) RθJC 23 °C/W Peak Package Reflow Temperature During Reflow(11), (12) TPPRT Note 12 °C Notes 7. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 8. Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal. 9. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. 10. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). 11. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 12. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. Table 3. Maximum Ratings (continued) All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit |
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Similar Description - MC34911BAC |
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