PTMA080152M

Confidential, Limited Internal Distribution

Data Sheet

10 of 11

Rev. 04, 2010-04-16

Package Outline Specifications

Package PG-DSO-20-63

Refer to Application Note "Recommendations for Printed Circuit Board Assembly of Infineon DSO and SSOP Packages" for

additional information.

2X 2.90

[0.114] MAX

(2 PLS)

13.00

[0.512] MAX

1

10

11

20

6.

INDEX PIN 1

6.

14.20±0.30

11.00

[0.433]

9 X 1.27 = 11.43

9 X .050 = .450

1.10

[0.043] MAX

(2 PLS)

2.95

[0.116]

6.00

[0.236]

TOP VIEW

BOTTOM VIEW

[0.559±0.012]

0.40+0.13

[0.015+0.005]

0.25mm

C A

B

15.90±0.10

[0.626±0.004]

1.27

[0.050]

14°±1° (2 PLS)

TOP/BOTTOM

ALL SIDES

11.00±0.10

[0.433±0.004]

5.

3.50

[0.137] MAX

SEE DETAIL A

4.

SIDE VIEW

END VIEW

M

SS

0.95±0.15

[0.037±0.006]

0.35

[0.014]

GAUGE PLANE

0.15

[0.006] REF

0+0.1

[0+0.004]

STANDOFF

1.60

[0.063] REF

–0.02

[0.010

]

+0.003

–0.001

DETAIL A

PG-DSO-20-63_po_02-19-2010

Diagram Notes—unless otherwise specified:

1. Interpret dimensions and tolerances per ASME Y14.5M-1994.

2. Package dimensions: 11.0 mm by 15.9 mm by 3.35 mm.

3. JEDEC drawing number: MO-166.

4. Does not include plastic or metal protrusion of 0.15 mm max per side.

5. Does not include dambar protrusion; maximum allowable dambar protrusion

shall be 0.08 mm.

6. Bottom metallization.

7. Sn plating (matte) : 5 – 15 micron [196.85 – 590.55 microinch].