IFX25401

General Product Characteristics

Data Sheet

5

Rev. 1.01, 2009-10-19

3

General Product Characteristics

3.1

Absolute Maximum Ratings

Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the

data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are

not designed for continuous repetitive operation.

3.2

Functional Range

T

1) not subject to production test, specified by design

Pos.

Parameter

Symbol

Limit Values

Unit

Test Condition

Min.

Max.

Input I

3.1.1

Voltage

V

I

-42

45

V

–

Voltage Adjust Input VA

3.1.2

Voltage

V

VA

-0.3

10

V

–

Output Q

3.1.3

Voltage

V

Q

-1

40

V

–

Temperature

3.1.4

Junction temperature

T

j

-40

150

°C–

3.1.5

Storage temperature

T

stg

-50

150

°C–

ESD Susceptibility

3.1.6

ESD Absorption

V

ESD,HBM

-2

2

kV

Human Body Model

2) ESD susceptibility Human Body Model “HBM” according to AEC-Q100-002 - JESD22-A114

3.1.7

V

ESD,CDM

-500

500

V

Charge Device

3) ESD susceptibility Charged Device Model “CDM” according to ESDA STM5.3.1

3.1.8

-750

750

V

Charge Device

Model (CDM) at

corner pins3)

Pos.

Parameter

Symbol

Limit Values

Unit Remarks

Min.

Max.

3.2.9

Input voltage

V

I

V

0.5

40

V

IFX25401TBV, IFX25401TEV;

IFX25401TBV50, IFX25401TEV50

V

3.2.10

Input voltage

V

I

4.5

40

V

IFX25401TBV, IFX25401TEV;

V