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TPS54328DDA Datasheet(PDF) 2 Page - Texas Instruments |
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TPS54328DDA Datasheet(HTML) 2 Page - Texas Instruments |
2 / 21 page TPS54328 SLVSAN2 – NOVEMBER 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) TRANSPORT TA PACKAGE(2) (3) ORDERABLE PART NUMBER PIN MEDIA TPS54328DDA Tube –45°C to 85°C DDA 8 TPS54328DDAR Tape and Reel (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (3) All package options have Cu NIPDAU lead/ball finish. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT MIN MAX VIN, EN –0.3 20 VBST –0.3 26 VBST (10 ns transient) –0.3 28 Input voltage range VBST (vs SW) –0.3 6.5 V VFB, SS –0.3 6.5 SW –2 20 SW (10 ns transient) –3 22 VREG5 –0.3 6.5 Output voltage V range GND –0.3 0.3 Voltage from GND to thermal pad, Vdiff –0.2 0.2 V Human Body Model (HBM) 2 kV Electrostatic discharge Charged Device Model (CDM) 500 V Operating junction temperature, TJ –40 150 °C Storage temperature, Tstg –55 150 (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL INFORMATION TPS54328 THERMAL METRIC(1) UNITS DDA (8 PINS) qJA Junction-to-ambient thermal resistance 42.1 qJCtop Junction-to-case (top) thermal resistance 50.9 qJB Junction-to-board thermal resistance 31.8 °C/W yJT Junction-to-top characterization parameter 5 yJB Junction-to-board characterization parameter 13.5 qJCbot Junction-to-case (bottom) thermal resistance 7.1 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s) :TPS54328 |
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