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IPP60R099C6 Datasheet(PDF) 5 Page - Infineon Technologies AG

Part # IPP60R099C6
Description  Metal Oxide Semiconductor Field Effect Transistor
Download  18 Pages
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Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

IPP60R099C6 Datasheet(HTML) 5 Page - Infineon Technologies AG

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600V CoolMOS™ C6 Power Transistor
IPx60R099C6
Thermal characteristics
Final Data Sheet
5
Rev. 2.1, 2010-02-09
3
Thermal characteristics
Table 3
Thermal characteristics TO-220 (IPP60R099C6),TO-247 (IPW60R099C6)
Parameter
Symbol
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
Thermal resistance, junction - case
R
thJC
-
-
0.45
°C/W
Thermal resistance, junction -
ambient
R
thJA
-
-
62
leaded
Soldering temperature,
wavesoldering only allowed at
leads
T
sold
-
-
260
°C
1.6 mm (0.063 in.)
from case for 10 s
Table 4
Thermal characteristics TO-220FullPAK (IPA60R099C6)
Parameter
Symbol
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
Thermal resistance, junction - case
R
thJC
--
3.6
°C/W
Thermal resistance, junction -
ambient
R
thJA
-
-
80
leaded
Soldering temperature,
wavesoldering only allowed at
leads
T
sold
-
-
260
°C
1.6 mm (0.063 in.)
from case for 10 s
Table 5
Thermal characteristics TO-263 (IPB60R099C6)
Parameter
Symbol
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
Thermal resistance, junction - case
R
thJC
-
-
0.45
°C/W
Thermal resistance, junction -
ambient
R
thJA
-
-
62
SMD version, device
on PCB, minimal
footprint
-
35
-
SMD version, device
on PCB, 6cm2 cooling
area1)
1) Device on 40mm*40mm*1.5mm one layer epoxy PCB FR4 with 6cm2 copper area (thickness 70µm) for drain connection.
PCB is vertical without air stream cooling.
Soldering temperature,
wave- & reflow soldering allowed
T
sold
-
-
260
°C
reflow MSL1


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