© 2008 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN7601B • Rev.1.0.1

10

Physical Dimensions

NOTES:

A) NO DRAWING STANDARD APPLIES TO THIS PACKAGE

B) ALL DIMENSIONS ARE IN MILLIMETERS.

C) DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,

AND TIE BAR EXTRUSIONS.

D) LAND PATTERN RECOMMENDATION IS FSC SOURCED.

E) DRAWING FILE NAME AND REVISION : MKT-MSB10A,REV1

LAND PATTERN RECOMMENDATION

DETAIL A

TOP VIEW

SIDE VIEW

END VIEW

5.12

4.72

4.00

4.15

3.75

6.30

5.70

PIN ONE

INDICATOR

(1.00)

#1

5

6

10

1.80 MAX

0.25

0.10

0.506

0.306

0.30

0.15

R0.20

SEE DETAIL A

SEATING PLANE

GAGE PLANE

8¡Æ

R0.15

R0.15

(0.36)

0.70

0.30

(2.04)

SCALE: 2:1

1.75

0.65

5.60

#1

(1.00)

(0.26)

Figure 19. 10-Lead, Small Outline Package (SSOP)

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Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: