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MM3Z5V6ST1 Datasheet(PDF) 1 Page - ON Semiconductor |
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MM3Z5V6ST1 Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 4 page © Semiconductor Components Industries, LLC, 2009 October, 2009 − Rev. 16 1 Publication Order Number: MM3Z2V4ST1/D MM3Z3V3ST1 SERIES Zener Voltage Regulators 200 mW SOD−323 Surface Mount Tight Tolerance Portfolio This series of Zener diodes is packaged in a SOD−323 surface mount package that has a power dissipation of 200 mW. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand−held portables, and high density PC boards. Specification Features: • Standard Zener Breakdown Voltage Range − 3.3 V to 36 V • Steady State Power Rating of 200 mW • Small Body Outline Dimensions: 0.067 ″ x 0.049″ (1.7 mm x 1.25 mm) • Low Body Height: 0.035″ (0.9 mm) • Package Weight: 4.507 mg/unit • ESD Rating of Class 3 (>16 kV) per Human Body Model • Tight Tolerance VZ • Pb−Free Packages are Available Mechanical Characteristics: CASE: Void-free, transfer-molded plastic FINISH: All external surfaces are corrosion resistant MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260 °C for 10 Seconds LEADS: Plated with Pb−Sn or Sn only (Pb−Free) POLARITY: Cathode indicated by polarity band FLAMMABILITY RATING: UL 94 V−0 MOUNTING POSITION: Any MAXIMUM RATINGS Rating Symbol Max Unit Total Device Dissipation FR−5 Board, (Note 1) @ TA = 25°C Derate above 25°C PD 200 1.5 mW mW/°C Thermal Resistance from Junction−to−Ambient RqJA 635 °C/W Junction and Storage Temperature Range TJ, Tstg −65 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−4 Minimum Pad. Device Package Shipping† ORDERING INFORMATION SOD−323 CASE 477 STYLE 1 1 Cathode 2 Anode MM3ZxxxST1 SOD−323 3000/Tape & Reel MARKING DIAGRAM See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. DEVICE MARKING INFORMATION XX = Specific Device Code M = Date Code* G = Pb−Free Package †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com MM3ZxxxST3 SOD−323 10,000/Tape & Reel MM3ZxxxST1G SOD−323 (Pb−Free) 3000/Tape & Reel MM3ZxxxST3G SOD−323 (Pb−Free) 10,000/Tape & Reel 1 2 XXMG G *Date Code orientation may vary depending upon manufacturing location. (Note: Microdot may be in either location) |
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