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CY62136FV30 Datasheet(PDF) 4 Page - Cypress Semiconductor |
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CY62136FV30 Datasheet(HTML) 4 Page - Cypress Semiconductor |
4 / 12 page CY62136FV30 MoBL® Document Number: 001-08402 Rev. *F Page 4 of 12 Thermal Resistance Tested initially and after any design or process changes that may affect these parameters. Parameter Description Test Conditions VFBGA TSOP II Unit ΘJA Thermal Resistance (Junction to Ambient) Still air, soldered on a 3 × 4.5 inch, two layer printed circuit board 75 77 °C/W ΘJC Thermal Resistance (Junction to Case) 10 13 °C/W Figure 3. AC Test Loads and Waveforms Parameters 2.5V (2.2V to 2.7V) 3.0V (2.7V to 3.6V) Unit R1 16667 1103 Ω R2 15385 1554 Ω RTH 8000 645 Ω VTH 1.20 1.75 V Data Retention Characteristics Over the Operating Range Parameter Description Conditions Min Typ [1] Max Unit VDR VCC for Data Retention 1.5 V ICCDR [7] Data Retention Current VCC = 1.5V, CE > VCC - 0.2V, VIN > VCC - 0.2V or VIN < 0.2V Industrial/Auto-A 4 μA Auto-E 12 tCDR [8] Chip Deselect to Data Retention Time 0 ns tR [9] Operation Recovery Time tRC ns Figure 4. Data Retention Waveform [10] VCC VCC OUTPUT R2 30 pF GND 90% 10% 90% 10% Rise Time = 1 V/ns Fall Time = 1 V/ns OUTPUT Equivalent to: THÉVENIN EQUIVALENT ALL INPUT PULSES RTH R1 V INCLUDING JIG AND SCOPE VCC(min) VCC(min) tCDR VDR > 1.5V DATA RETENTION MODE tR VCC CE or BHE.BLE Notes 8. Tested initially and after any design or process changes that may affect these parameters. 9. Full device operation requires linear VCC ramp from VDR to VCC(min) > 100 μs or stable at VCC(min) > 100 μs. 10. BHE.BLE is the AND of both BHE and BLE. Deselect the chip by either disabling chip enable signals or by disabling both BHE and BLE. [+] Feedback |
Similar Part No. - CY62136FV30_09 |
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Similar Description - CY62136FV30_09 |
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