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NCS2220A Datasheet(PDF) 1 Page - ON Semiconductor

Part # NCS2220A
Description  Low Voltage Comparator
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCS2220A Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2009
October, 2009 − Rev. 1
1
Publication Order Number:
NCS2220A/D
NCS2220A
Low Voltage Comparator
The NCS2220A is an industry first sub−one volt, low power dual
comparator. This device consumes only 7.5
mA per Comparator of
supply current. It is guaranteed to operate at a low voltage of 0.85 V
which allows it to be used in systems that require less than 1.0 V and is
fully operational up to 6.0 V which makes it convenient for use in both
3.0 V and 5.0 V systems. Additional features include no output phase
inversion with overdriven inputs, internal hysteresis, which allows for
clean output switching, and rail−to−rail input and output performance.
The NCS2220A is available in the tiny UDFN 1.6 X 1.6 package.
Features
Operating Voltage of 0.85 V to 6.0 V
Rail−to−Rail Input/Output Performance
Low Supply Current of 7.5 mA per Comparator Typ
No Phase Inversion with Overdriven Input Signals
Internal Hysteresis
Propagation Delay of 0.5 ms
This is a Pb−Free Device
Typical Applications
Single Cell NiCd/NiMH Battery Powered Applications
Cellular Telephones
Alarm and Security Systems
Personal Digital Assistants
UDFN8 1.6 X 1.6
MU SUFFIX
CASE 517AC
http://onsemi.com
Device
Package
Shipping
ORDERING INFORMATION
NCS2220AMUT1G Complementary
UDFN 1.6 X 1.6
3000/
Tape & Reel
1
3
VCC
IN+1
2
IN−1
OUT1
6 IN−2
7
8
OUT2
PIN CONNECTIONS
Top View
4
VEE
5 IN+2
1
8
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
CZ MG
G
1
CZ
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
MARKING DIAGRAM
NOTE: The NCS2220A has three exposed pads on
the bottom side which may be used to reduce
thermal resistance by soldering to a copper heat−
spreader. Electrically the exposed pads must be
allowed to float.


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