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CY7C63801-SXC Datasheet(PDF) 5 Page - Cypress Semiconductor |
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CY7C63801-SXC Datasheet(HTML) 5 Page - Cypress Semiconductor |
5 / 83 page CY7C63310, CY7C638xx Document 38-08035 Rev. *K Page 5 of 83 Figure 5-2. CY7C63823 Die Form Die step = 1792.98 μm x 2272.998 μm Die size = 1727 μm x 2187 μm Bond pad opening = 70 μm x 70 μm Die thickness = 14 mils Legend 1 2 4 3 5 6 8 7 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 Cypress Logo X Y Table 5-1. Die Pad Summary Pad Number Pad Name X (microns) Y (microns) 1 P0.7 -742.730 911.990 2 P0.6 -755.060 792.200 3 P0.5 -755.060 699.300 4 P0.4 -755.060 606.400 5 P0.3 -755.060 -430.080 6 P0.2 -755.060 -522.980 7 P0.1 -755.060 -618.830 8 P0.0 CLKIN -755.060 -714.020 9 P2.1 -755.060 -810.220 10 P2.0 -393.580 -977.930 11 VSS 537.500 -964.700 12 PI.0 D+ 736.110 -936.680 13 P1.1 D– 736.110 -625.130 14 VDD 736.110 -260.670 15 P1.2 VREG 736.110 53.800 16 P1.3 723.510 336.780 17 P3.0 723.510 438.690 18 P3.1 723.510 532.880 19 P1.4 723.510 635.310 20 P1.5 SMOSI 723.510 728.220 21 P1.6 SMISO 723.510 839.290 22 P1.7 696.630 1008.480 23 Reserved -795.400 1023.270 [+] Feedback [+] Feedback |
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