AMIS−30522, NCV70522

http://onsemi.com

5

PACKAGE THERMAL CHARACTERISTICS

The 522 is available in a NQFP32 package. For cooling

optimizations, the NQFP has an exposed thermal pad which

has to be soldered to the PCB ground plane. The ground

plane needs thermal vias to conduct the heat to the bottom

layer. Figure 3 gives an example for good power distribution

solutions.

For precise thermal cooling calculations the major

thermal resistances of the device are given. The thermal

media to which the power of the devices has to be given are:

The thermal resistances are presented in Table 5: DC

Parameters.

The major thermal resistances of the device are the Rth

from the junction−to−ambient (Rthja) and the overall Rth

from the junction−to−exposed pad (Rthjp). In the table

below one can find the values for the Rthja and Rthjp,

simulated according to JESD−51:

The Rthja for 2S2P is simulated conform JEDEC JESD−51

as follows:

and outer (top and bottom) signal layers is used

The Rthja for 1S0P is simulated conform JEDEC JESD−51

as follows:

Figure 3. Example of NQFP−32 PCB Ground Plane Layout in Top View (Preferred Layout at Top and Bottom)

NQFP−32

ELECTRICAL SPECIFICATION

Recommended Operation Conditions

Operating ranges define the limits for functional

operation and parametric characteristics of the device. Note

that the functionality of the chip outside these operating

ranges is not guaranteed. Operating outside the

recommended operating ranges for extended periods of time

may affect device reliability.

Table 4. OPERATING RANGES

Symbol

Parameter

Min

Max

Unit

Analog DC supply

+6

+30

V

Logic supply output voltage

4.75

5.25

V

Junction temperature

−40

+172 (Note 5)

°C