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T8100 Datasheet(PDF) 8 Page - Intel Corporation

Part # T8100
Description  Core2 Duo Processor and Core2 Extreme Processor on 45-nm Process
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Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

T8100 Datasheet(HTML) 8 Page - Intel Corporation

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Introduction
8
Datasheet
1.1
Terminology
Term
Definition
#
A “#” symbol after a signal name refers to an active low signal, indicating a
signal is in the active state when driven to a low level. For example, when
RESET# is low, a reset has been requested. Conversely, when NMI is high,
a nonmaskable interrupt has occurred. In the case of signals where the
name does not imply an active state but describes part of a binary
sequence (such as address or data), the “#” symbol implies that the signal
is inverted. For example, D[3:0] = “HLHL” refers to a hex ‘A’, and D[3:0]#
= “LHLH” also refers to a hex “A” (H= High logic level, L= Low logic level).
AGTL+
Advanced Gunning Transceiver Logic. Used to refer to Assisted GTL+
signaling technology on some Intel® processors.
Enhanced Intel
SpeedStep®
Technology
Technology that provides power management capabilities to laptops.
Execute Disable
Bit
The Execute Disable bit allows memory to be marked as executable or non-
executable, when combined with a supporting operating system. If code
attempts to run in non-executable memory the processor raises an error to
the operating system. This feature can prevent some classes of viruses or
worms that exploit buffer overrun vulnerabilities and can thus help improve
the overall security of the system. See the Intel® Architecture Software
Developer's Manual for more detailed information.
Front Side Bus
(FSB)
Refers to the interface between the processor and system core logic (also
known as the chipset components).
Half ratio support
(N/2) for Core to
Bus ratio
Penryn processor support the N/2 feature which allows having fractional
core to bus ratios. This feature provides the flexibility of having more
frequency options and be able to have products with smaller frequency
steps.
Intel® 64
Technology
64-bit memory extensions to the IA-32 architecture.
Intel®
Virtualization
Technology
Processor virtualization which, when used in conjunction with Virtual
Machine Monitor software enables multiple, robust independent software
environments inside a single platform.
Processor Core
Processor core die with integrated L1 and L2 cache. All AC timing and
signal integrity specifications are at the pads of the processor core.
Storage
Conditions
Refers to a non-operational state. The processor may be installed in a
platform, in a tray, or loose. Processors may be sealed in packaging or
exposed to free air. Under these conditions, processor landings should not
be connected to any supply voltages, have any I/Os biased or receive any
clocks. Upon exposure to “free air” (i.e., unsealed packaging or a device
removed from packaging material) the processor must be handled in
accordance with moisture sensitivity labeling (MSL) as indicated on the
packaging material.
TDP
Thermal Design Power.
VCC
The processor core power supply.
VSS
The processor ground.


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