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E6000 Datasheet(PDF) 5 Page - Intel Corporation |
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E6000 Datasheet(HTML) 5 Page - Intel Corporation |
5 / 122 page Datasheet 5 Figures 1VCC Static and Transient Tolerance for Processors with 4 MB L2 Cache ............................ 23 2VCC Static and Transient Tolerance for Processors with 2 MB L2 Cache ............................ 25 3VCC Overshoot Example Waveform ............................................................................. 26 4 Differential Clock Waveform ...................................................................................... 33 5 Differential Clock Crosspoint Specification ................................................................... 33 6 Differential Measurements......................................................................................... 33 7 Differential Clock Crosspoint Specification ................................................................... 34 8 Processor Package Assembly Sketch ........................................................................... 37 9 Processor Package Drawing Sheet 1 of 3 ..................................................................... 38 10 Processor Package Drawing Sheet 2 of 3 ..................................................................... 39 11 Processor Package Drawing Sheet 3 of 3 ..................................................................... 40 12 Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processor E6000 Sequence with 4 MB L2 Cache with 1333 MHz FSB.............................................. 42 13 Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processors E6000 Sequence with 4 MB L2 Cache with 1066 MHz FSB.............................................. 43 14 Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processors E6000 Sequence with 2 MB L2 Cache.......................................................................... 43 15 Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processors E4000 Sequence with 2 MB L2 Cache.......................................................................... 44 16 Processor Top-Side Markings for the Intel® Core™2 Extreme Processor X6800 ................. 44 17 Processor Land Coordinates and Quadrants (Top View) ................................................. 45 18 land-out Diagram (Top View – Left Side) ..................................................................... 48 19 land-out Diagram (Top View – Right Side) ................................................................... 49 20 Thermal Profile (Intel® Core™2 Duo Desktop Processor E6x50 Sequence and E6540 with 4 MB L2 Cache)................................................................................................. 81 21 Thermal Profile (Intel® Core™ Duo Desktop Processor E6000 Sequence with 4 MB L2 Cache) ....................................................................................................... 82 22 Thermal Profile (Intel® Core™2 Duo Desktop Processor E4500 and E4600 with 2 MB L2 Cache) ....................................................................................................... 83 23 Thermal Profile (Intel® Core™ Duo Desktop Processor E6000 and E4000 Sequence with 2 MB L2 Cache)................................................................................................. 84 24 Thermal Profile (Intel® Core™2 Extreme Processor X6800)............................................ 85 25 Case Temperature (TC) Measurement Location ............................................................ 86 26 Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 88 27 Processor PECI Topology ........................................................................................... 92 28 Conceptual Fan Control on PECI-Based Platforms ......................................................... 93 29 Conceptual Fan Control on Thermal Diode-Based Platforms............................................ 93 30 Processor Low Power State Machine ........................................................................... 96 31 Mechanical Representation of the Boxed Processor ..................................................... 101 32 Space Requirements for the Boxed Processor (Side View)............................................ 102 33 Space Requirements for the Boxed Processor (Top View)............................................. 102 34 Space Requirements for the Boxed Processor (Overall View) ........................................ 103 35 Boxed Processor Fan Heatsink Power Cable Connector Description ................................ 104 36 Baseboard Power Header Placement Relative to Processor Socket ................................. 105 37 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ................. 106 38 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)................. 106 39 Boxed Processor Fan Heatsink Set Points................................................................... 108 40 Mechanical Representation of the Boxed Processor with a Type I TMA ........................... 111 41 Mechanical Representation of the Boxed Processor with a Type II TMA .......................... 112 42 Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes..... 113 43 Requirements for the Balanced Technology Extended (BTX) Type II Keep-out Volume ..... 114 44 Assembly Stack Including the Support and Retention Module ....................................... 115 45 Boxed Processor TMA Power Cable Connector Description ............................................ 116 46 Balanced Technology Extended (BTX) Mainboard Power Header Placement (hatched area) ...................................................................................................... 117 47 Boxed Processor TMA Set Points............................................................................... 119 |
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