QX6800 datasheet(3/98 Pages) INTEL

Part #	QX6800

Description	on 65 nm Process in the 775-land LGA Package supporting Intel 64 architecture

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Manufacturer	INTEL [Intel Corporation]

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Contents

1Introduction ..............................................................................................................9

1.1

Terminology .......................................................................................................9

1.1.1

Processor Terminology ............................................................................ 10

1.2

References ....................................................................................................... 11

2

Electrical Specifications ........................................................................................... 13

2.1

Power and Ground Lands.................................................................................... 13

2.2

Decoupling Guidelines........................................................................................ 13

2.2.1

VCC Decoupling ..................................................................................... 13

2.2.2

VTT Decoupling...................................................................................... 13

2.2.3

FSB Decoupling...................................................................................... 14

2.3

Voltage Identification ......................................................................................... 14

2.4

Reserved, Unused, and TESTHI Signals ................................................................ 16

2.5

Voltage and Current Specification ........................................................................ 17

2.5.1

Absolute Maximum and Minimum Ratings .................................................. 17

2.5.2

DC Voltage and Current Specification ........................................................ 18

2.5.3

VCC Overshoot ...................................................................................... 21

2.5.4

Die Voltage Validation ............................................................................. 21

2.6

Signaling Specifications...................................................................................... 22

2.6.1

FSB Signal Groups.................................................................................. 22

2.6.2

CMOS and Open Drain Signals ................................................................. 24

2.6.3

Processor DC Specifications ..................................................................... 24

2.6.3.1

GTL+ Front Side Bus Specifications ............................................. 26

2.7

Clock Specifications ........................................................................................... 26

2.7.1

Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 26

2.7.2

FSB Frequency Select Signals (BSEL[2:0])................................................. 27

2.7.3

Phase Lock Loop (PLL) and Filter .............................................................. 27

2.7.4

BCLK[1:0] Specifications ......................................................................... 28

3

Package Mechanical Specifications .......................................................................... 31

3.1

Package Mechanical Drawing............................................................................... 31

3.2

Processor Component Keep-Out Zones................................................................. 35

3.3

Package Loading Specifications ........................................................................... 35

3.4

Package Handling Guidelines............................................................................... 35

3.5

Package Insertion Specifications.......................................................................... 36

3.6

Processor Mass Specification............................................................................... 36

3.7

Processor Materials............................................................................................ 36

3.8

Processor Markings............................................................................................ 36

3.9

Processor Land Coordinates ................................................................................ 38

4

Land Listing and Signal Descriptions ....................................................................... 39

4.1

Processor Land Assignments ............................................................................... 39

4.2

Alphabetical Signals Reference ............................................................................ 62

5

Thermal Specifications and Design Considerations .................................................. 71

5.1

Processor Thermal Specifications ......................................................................... 71

5.1.1

Thermal Specifications ............................................................................ 71

5.1.2

Thermal Metrology ................................................................................. 76

5.2

Processor Thermal Features ................................................................................ 76

5.2.1

Thermal Monitor..................................................................................... 76

5.2.2

Thermal Monitor 2 .................................................................................. 77

5.2.3

On-Demand Mode .................................................................................. 78

5.2.4

PROCHOT# Signal .................................................................................. 79

Similar Description - QX6800

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