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317610-001 Datasheet(PDF) 9 Page - Intel Corporation

Part # 317610-001
Description  Express Chipset
Download  342 Pages
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Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

317610-001 Datasheet(HTML) 9 Page - Intel Corporation

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Functional Description........................................................................................... 265
10.1 Host Interface................................................................................................. 265
10.1.1 FSB IOQ Depth .................................................................................... 265
10.1.2 FSB OOQ Depth ................................................................................... 265
10.1.3 FSB GTL+ Termination .......................................................................... 265
10.1.4 FSB Dynamic Bus Inversion ................................................................... 265
10.1.5 APIC Cluster Mode Support.................................................................... 266
10.2 System Memory Controller ............................................................................... 267
10.2.1 System Memory Organization Modes....................................................... 267
10.2.1.1 Single Channel Mode ............................................................... 267
10.2.1.2 Dual Channel Modes................................................................ 267
10.2.2 System Memory Technology Supported ................................................... 269
10.2.3 Error Checking and Correction................................................................ 270
10.3 PCI Express* .................................................................................................. 273
10.3.1 PCI Express* Architecture ..................................................................... 273
10.3.1.1 Transaction Layer ................................................................... 273
10.3.1.2 Data Link Layer ...................................................................... 273
10.3.1.3 Physical Layer ........................................................................ 273
10.4 Thermal Sensor............................................................................................... 274
10.4.1 PCI Device 0, Function 0 ....................................................................... 274
10.4.2 MCHBAR Thermal Sensor Registers......................................................... 274
10.5 Power Management ......................................................................................... 275
10.6 Clocking......................................................................................................... 275
11
Electrical Characteristics ....................................................................................... 277
11.1 Absolute Minimum and Maximum Ratings ........................................................... 277
11.2 Current Consumption....................................................................................... 279
11.3 Signal Groups ................................................................................................. 280
11.4 Buffer Supply and DC Characteristics ................................................................. 283
11.4.1 I/O Buffer Supply Voltages .................................................................... 283
11.4.2 General DC Characteristics .................................................................... 284
12
Ballout and Package Information........................................................................... 287
12.1 Ballout Information.......................................................................................... 287
12.2 Package Information........................................................................................ 311
13
Testability ............................................................................................................. 313
13.1 XOR Test Mode Initialization ............................................................................. 313
13.2 XOR Chain Definition ....................................................................................... 314
13.3 XOR Chains .................................................................................................... 315
13.3.1 XOR Chains for DDR2 (No ECC).............................................................. 316
13.3.2 XOR Chains for DDR2 (ECC) .................................................................. 325
13.3.3 XOR Chains for DDR3 (No ECC).............................................................. 334


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