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Datasheet—82567

Contents

1.0

Introduction ..............................................................................................................5

1.1

Scope ................................................................................................................6

1.2

Reference Documents ..........................................................................................6

1.3

Product Codes.....................................................................................................6

2.0

Signal Descriptions....................................................................................................7

2.1

Signal Type Definitions.........................................................................................7

2.2

GLCI Interface Pins..............................................................................................7

2.3

LCI Interface Pins................................................................................................8

2.4

Miscellaneous Pins ...............................................................................................8

2.5

PHY Pins ............................................................................................................9

2.5.1

LED Pins .................................................................................................9

2.5.2

Analog Pins .............................................................................................9

2.5.3

Testability Pins.........................................................................................9

2.6

Power Supply Pins ............................................................................................. 10

3.0

Features .................................................................................................................. 11

3.1

Feature Matrix and Product Information................................................................ 11

3.2

Power Saving Features....................................................................................... 12

3.2.1

3.2.2

Link Speed Battery Saver ........................................................................ 12

3.2.3

System Idle Power Saver (SIPS) .............................................................. 13

3.2.4

Low Power Link Up (LPLU) ....................................................................... 13

3.2.5

LAN Disable........................................................................................... 14

4.0

Voltage, Temperature, and Timing Specifications .................................................... 16

4.1

Recommended Operating Conditions .................................................................... 16

4.2

DC and AC Characteristics .................................................................................. 16

4.3

LED Electrical Specification ................................................................................. 16

4.4

Crystal Specifications......................................................................................... 17

4.5

Oscillator Specifications...................................................................................... 19

4.5.1

Oscillator High Voltage Configuration ........................................................ 19

4.6

Power Consumption ........................................................................................... 20

4.7

Power Delivery.................................................................................................. 23

4.7.1

The 1.8 V-1.9 V Rail ............................................................................... 23

4.7.2

The 1.05 V Rail ...................................................................................... 23

4.7.3

Voltage Regulator Schematics .................................................................. 23

4.7.4

Voltage Regulator Power Supply Specifications ........................................... 24

4.7.5

PNP Specifications .................................................................................. 25

4.7.6

Power Sequencing .................................................................................. 25

4.8

Timing Parameters ............................................................................................ 26

4.8.1

Timing Requirements .............................................................................. 26

4.8.2

Timing Guarantees ................................................................................. 26

5.0

Package and Pinout Information ............................................................................. 27

5.1

Package Information.......................................................................................... 27

5.2

Thermal ........................................................................................................... 27

5.3

Internal Pull-Up Resistors ................................................................................... 28

5.4

Visual Pin Assignments....................................................................................... 29