PUML1_DG_1

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 01 — 14 July 2008

4 of 12

NXP Semiconductors

PUML1/DG

50 V, 200 mA NPN general-purpose transistor/100 mA NPN RET

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Per transistor

thermal resistance from junction

to ambient

in free air

[1] -

-

625

K/W

Per device

thermal resistance from junction

to ambient

in free air

[1] -

-

417

K/W

FR4 PCB, standard footprint

Fig 2.

Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration

006aab255

10

1

10

(K/W)

1

duty cycle =

1

0.75

0.5

0.33

0.2

0.1

0.05

0.02

0.01

0