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74LVC1GX04DBVRG4 Datasheet(PDF) 1 Page - Texas Instruments |
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74LVC1GX04DBVRG4 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 19 page www.ti.com FEATURES See mechanical drawings for dimensions. DNU – Do not use NC – No internal connection DBV PACKAGE (TOP VIEW) 6 5 1 Y V CC NC 2 GND 3 4 X1 X2 DRL PACKAGE (TOP VIEW) 2 GND Y V CC 6 5 1 NC 3 4 X1 X2 DCK PACKAGE (TOP VIEW) 2 GND 3 4 X1 Y V CC 6 5 NC X2 1 YEP OR YZP PACKAGE (BOTTOM VIEW) 2 GND Y V CC 1 5 5 DNU X1 4 3 X2 DESCRIPTION/ORDERING INFORMATION SN74LVC1GX04 CRYSTAL OSCILLATOR DRIVER SCES581B – JULY 2004 – REVISED DECEMBER 2006 • Available in Texas Instruments NanoStar™ • ±24-mA Output Drive at 3.3 V and NanoFree™ Packages • I off Supports Partial-Power-Down Mode • Supports 5-V V CC Operation Operation • Inputs Accept Voltages to 5.5 V • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • One Unbuffered Inverter (SN74LVC1GU04) and One Buffered Inverter (SN74LVC1G04) • ESD Protection Exceeds JESD 22 • Suitable for Commonly Used Clock – 2000-V Human-Body Model (A114-A) Frequencies: – 200-V Machine Model (A115-A) – 15 kHz, 3.58 MHz, 4.43 MHz, 13 MHz, – 1000-V Charged-Device Model (C101) 25 MHz, 26 MHz, 27 MHz, 28 MHz • Max t pd of 2.4 ns at 3.3 V • Low Power Consumption, 10-µA Max I CC The SN74LVC1GX04 is designed for 1.65-V to 5.5-V VCC operation. This device incorporates the SN74LVC1GU04 (inverter with unbuffered output) and the SN74LVC1G04 (inverter) functions into a single device. The LVC1GX04 is optimized for use in crystal oscillator applications. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoStar™ – WCSP (DSBGA) SN74LVC1GX04YEPR(3) PREVIEW 0.23-mm Large Bump – YEP Reel of 3000 NanoFree™ – WCSP (DSBGA) SN74LVC1GX04YZPR(3) PREVIEW 0.23-mm Large Bump – YZP (Pb-free) Reel of 3000 SN74LVC1GX04DBVR –40 °C to 85°C SOT (SOT-23) – DBV CX4_ Reel of 250 SN74LVC1GX04DBVT Reel of 3000 SN74LVC1GX04DCKR SOT (SC-70) – DCK D2_ Reel of 250 SN74LVC1GX04DCKT SOT (SOT-553) – DRL Reel of 4000 SN74LVC1GX04DRLR UC_ (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). (3) Package preview Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar, NanoFree are trademarks of Texas Instruments. UNLESS OTHERWISE NOTED this document contains Copyright © 2004–2006, Texas Instruments Incorporated PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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