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SL3S1203_1213 Datasheet(PDF) 8 Page - NXP Semiconductors |
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SL3S1203_1213 Datasheet(HTML) 8 Page - NXP Semiconductors |
8 / 22 page SL3S1203_1213_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product short data sheet PUBLIC Rev. 3.2 — 9 November 2010 198732 8 of 22 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ 10.1.2 Fail die identification No inkdots are applied to the wafer. Electronic wafer mapping (SECS II format) covers the electrical test results and additionally the results of mechanical/visual inspection. See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BU-ID document number: 1093**” 10.1.3 Map file distribution See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BU-ID document number: 1093**” Bump size – RFP, RFN 60 × 60 μm – OUT, VDD 60 × 60 μm Bump size variation ± 5 μm Table 6. Specifications |
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