SL3S1203_1213 datasheet(8/22 Pages) NXP

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SL3S1203_1213_SDS

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Product short data sheet

PUBLIC

Rev. 3.2 — 9 November 2010

198732

8 of 22

NXP Semiconductors

SL3S1203_1213

UCODE G2iL and G2iL+

10.1.2 Fail die identification

No inkdots are applied to the wafer.

Electronic wafer mapping (SECS II format) covers the electrical test results and

additionally the results of mechanical/visual inspection.

See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on

UV-tape with electronic fail die marking, BU-ID document number: 1093**”

10.1.3 Map file distribution

See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on

UV-tape with electronic fail die marking, BU-ID document number: 1093**”

Bump size

– RFP, RFN

60 × 60 μm

– OUT, VDD

60 × 60 μm

Bump size variation

± 5 μm

Table 6.

Specifications

Similar Part No. - SL3S1203_1213

Manufacturer	Part #	Datasheet	Description
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