APX809-31SAG-7 datasheet(3/9 Pages) DIODES

Part #	APX809-31SAG-7

Description	3-PIN MICROPROCESSOR RESET CIRCUITS

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Manufacturer	DIODES [Diodes Incorporated]

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APX809/810

3-PIN MICROPROCESSOR RESET CIRCUITS

APX809/810 Rev. 4

3 of 9

FEBRUARY 2009

www.diodes.com

Recommended Operating Conditions

Symbol

Parameter

Min

Max

Unit

VCC

Supply Voltage

1.1

5.5

V

VIN

Input Voltage

0

(VCC+0.3)

V

TA

Operating Ambient Temperature Range

-40

85

oC

TR

Vcc Rising Time (Vcc = 0~VT)

100

V/ uS

Electrical Characteristics

(TA = 25ºC)

TA= -40 to 85

oC unless otherwise note. Typical values are at T

A=+25

oC.

Symbol

Parameter

Test Conditions

Min

Typ.

Max

Unit

VCC

VCC Range

TA = 0

oC to +70oC

1.0

5.5

V

ICC

Supply Current

VTH + 0.2V

30

40

μA

VTH

Reset

Threshold

APX809/810-23

TA = 0

oC-85oC

2.21

2.25

2.30

V

APX809/810-26

2.59

2.63

2.69

APX809/810-29

2.88

2.93

3.00

APX809/810-31

3.02

3.08

3.15

APX809/810-40

3.93

4.00

4.08

APX809/810-44

4.31

4.38

4.47

APX809/810-46

4.56

4.63

4.72

APX809/810-23

TA = -40

oC-85oC

2.20

2.25

2.30

V

APX809/810-26

2.57

2.63

2.69

APX809/810-29

2.86

2.93

3.00

APX809/810-31

3.00

3.08

3.15

APX809/810-40

3.92

4.00

4.08

APX809/810-44

4.29

4.38

4.47

APX809/810-46

4.54

4.63

4.72

Reset Threshold Tempco

30

ppm/

oC

TS

Set-up Time

VCC = VTH to (VTH – 100mV)

20

μs

TDELAY Reset Active Timeout Period

TA = 0

oC to +85oC

140

200

280

ms

VOL

T

RESE

Output Voltage Low

(APX809)

VCC = VTH -0.2, ISINK = 1.2mA

0.3

V

VCC = VTH -0.2, ISINK = 3.2mA

0.4

VCC > 1.0V, ISINK = 50uA

0.3

VOH

T

RESE

Output Voltage-High

(APX809)

VCC > VTH +0.2,

ISOURCE = 500uA

0.8VCC

V

VCC > VTH +0.2,

ISOURCE = 800uA

VCC –1.5

VOL

RESET Output Voltage-Low

(APX810)

VCC = VTH +0.2, ISINK = 1.2mA

0.3

V

VCC = VTH +0.2, ISINK = 3.2mA

0.4

VOH

RESET Output Voltage-High

(APX810)

1.8V < VCC < VTH -0.2,

ISOURCE = 150uA

0.8 VCC

V

θ

JA

Thermal Resistance

Junction-to-Ambient

SOT23/SOT23R (Note 3)

201

oC/W

θ

JC

Thermal Resistance

Junction-to-Case

SOT23/SOT23R (Note 3)

56

oC/W

Notes:

3. Test condition for SOT23/ SOT23R: Devices mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.

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