AXK(5/6)F

NOTES

1. As shown below, excess force

during insertion may result in damage

to the connector or removal of the

solder. Please be careful. Also, to

prevent connector damage please

confirm the correct position before

mating connectors.

2. Keep the PC board warp no more

than 0.03 mm in relation to the overall

length of the connector.

3. PC Boards and Recommended

Metal Mask Patterns

Connectors are mounted with high

density, with a pitch interval of 0.4 to 0.5

mm. It is therefore necessary to make

sure that the right levels of solder are

used, in order to reduce solder bridge

and other issues. The figures to the right

are recommended metal mask patterns.

Please use them as a reference.

• Socket

Recommended PC board pattern

(TOP VIEW)

Recommended metal mask pattern

Metal mask thickness: Here, 150

µm

(Opening area ratio: 56%)

Recommended metal mask pattern

Metal mask thickness: Here, 120

µm

(Opening area ratio: 69%)

• Header

Recommended PC board pattern

(TOP VIEW)

Recommended metal mask pattern

Metal mask thickness: Here, 150

µm

(Opening area ratio: 58%)

Recommended metal mask pattern

Metal mask thickness: Here, 120

µm

(Opening area ratio: 72%)

Max. 0.03mm

Max. 0.03mm

B

±0.05

0.25

±0.05

0.125

±0.05

0.30

±0.05

0.50

±0.05

0.50

±0.05

0.23

±0.01

0.50

±0.01

0.50

±0.01

B

±0.01

0.50

±0.01

0.50

±0.01

0.23

±0.01

B

±0.01

0.125

±0.05

0.30

±0.05

B

±0.05

0.25

±0.05

0.50

±0.05

0.50

±0.05

0.23

±0.01

0.50

±0.01

0.50

±0.01

B

±0.01

0.50

±0.01

0.50

±0.01

0.23

±0.01

B

±0.01

* See the dimension table on page 91 for more information on the B dimension of the socket and header.

For other details, please verify with

the product specification sheets.

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