PMEG4010CEH_PMEG4010CEJ_2

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 02 — 22 March 2007

7 of 10

NXP Semiconductors

PMEG4010CEH; PMEG4010CEJ

11. Soldering

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 7.

Reflow soldering footprint SOD123F

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 8.

Reflow soldering footprint SOD323F (SC-90)

1.6

1.6

2.9

4

4.4

1.1 1.2

2.1

1.1

(2

×)

solder lands

solder resist

occupied area

solder paste

001aab169

1.65

0.50

(2

×)

2.10

1.60

2.80

0.60

3.05

0.50

0.95

solder lands

solder resist

occupied area

solder paste