10

4952I–AUTO–08/10

ATA6836

5.

Thermal Resistance

4.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating

only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this

specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

All values refer to GND pins.

Parameters

Pin SO28 Pin QFN24

Symbol

Value

Unit

Supply voltage

5, 10

3, 4

–0.3 to +40

V

5, 10

3, 4

–1

V

Supply voltage difference

5, 10

3, 4

ΔV

VS

150

mV

Logic supply voltage

19

14

V

VCC

–0.3 to +7

V

Logic input voltage

24-26

17-19

V

–0.3 to V

V

Logic output voltage

18

13

V

DO

–0.3 to V

V

Input current

17, 24-26

12, 17-19

I

–10 to +10

mA

Output current

18

13

I

DO

–10 to +10

mA

Output current

1-4, 11-16,

27, 28

2, 5, 8, 11,

20, 23

I

Internally limited, see

“Output Specification” in

Section 7. on page 11

Output voltage

2, 3, 12,

13, 15, 28

2, 5, 8, 11,

20, 23

OUT1 to OUT6

–0.3 to +40

V

1, 4, 11,

14, 16, 27

Junction temperature range

T

j

–40 to +150

°C

Storage temperature range

–55 to +150

°C

Table 5-1.

SO28

Parameter

Test Conditions

Pin

Symbol

Min.

Typ.

Max.

Unit

Junction pin

Measured to GND

6 to 9, 20 to 23

R

thJP

25

K/W

Junction ambient

R

thJA

65

K/W

Table 5-2.

QFN24: Depends on the PCB-board

Parameter

Test Conditions

Pin

Symbol

Min.

Typ.

Max.

Unit

Junction pin

16

R

thJP

< 5

K/W

Junction ambient

R

thJA

35

K/W