Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
0878352043
|
105Kb / 3P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 20 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
0878355043
|
105Kb / 3P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
0878351043
|
105Kb / 3P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 10 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
0878351643
|
105Kb / 3P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 16 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
0878354042
|
118Kb / 3P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 40 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
0702460801
|
187Kb / 4P |
2.54mm (.100) Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
0878341048
|
101Kb / 3P |
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 10 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
0879114011
|
372Kb / 6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 40 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
0015800409
|
1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
|
0878352442
|
118Kb / 3P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 24 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|