| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
0879200014
|
1Mb / 13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, Tin (Sn) Overall Plating, with Pick-and-Place Cap
|
|
0879200833
|
1Mb / 16P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 2.50關m (98關) Tin (Sn) Plating, with Pick-and-Place Cap, without Peg
|
|
0879209346
|
1Mb / 13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 34 Circuits, Tin (Sn) Overall Plating, without Cap, without Peg, Tube Packaging, Lead-free
|
|
0879200830
|
1Mb / 12P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 2.50關m (98關) Tin (Sn) Plating, with Pick-and-Place Cap
|
|
0879209311
|
1Mb / 13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Overall Plating, with Cap, without Peg, Tape on Reel Packaging, Lead-free
|
|
0015912200
|
1Mb / 8P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 20 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
|
|
15-91-2200
|
35Kb / 2P |
2.54mm Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 20 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
|
|
0015800207
|
1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
|
|
0015800201
|
1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
|
|
0879208115
|
1Mb / 13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Plating, with Pick-and-Place Cap, with Peg, Tape and Reel
|
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