Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
70567-0120
|
1Mb / 7P |
2.54mm (.100") Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating
|
70567-0125
|
1Mb / 7P |
2.54mm (.100") Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating
|
70567-0131
|
1Mb / 7P |
2.54mm (.100") Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 62 Circuits, Tin (Sn) Plating
|
70567-0137
|
1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
70567-0137
|
51Kb / 2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
|