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KM416S8030 Datasheet(PDF) 1 Page - Samsung semiconductor

Part # KM416S8030
Description  2M x 16Bit x 4 Banks Synchronous DRAM
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

KM416S8030 Datasheet(HTML) 1 Page - Samsung semiconductor

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KM416S8030
CMOS SDRAM
REV. 2 Mar. '98
Preliminary
The KM416S8030 is 134,217,728 bits synchronous high data
rate Dynamic RAM organized as 4 x 2,097,152 words by 16
bits, fabricated with SAMSUNG
′s high performance CMOS
technology. Synchronous design allows precise cycle control
with the use of system clock I/O transactions are possible on
every clcok cycle. Range of operating frequencies, programma-
ble burst length and programmable latencies allow the same
device to be useful for a variety of high bandwidth, high perfor-
mance memory system applications.
• JEDEC standard 3.3V power supply
• LVTTL compatible with multiplexed address
• Four banks operation
• MRS cycle with address key programs
-. CAS Latency (2 & 3)
-. Burst Length (1, 2, 4, 8 & full page)
-. Burst Type (Sequential & Interleave)
• All inputs are sampled at the positive going edge of the system
clock.
• Burst Read Single-bit Write operation
• DQM for masking
• Auto & self refresh
• 64ms refresh period (4K cycle)
GENERAL DESCRIPTION
FEATURES
FUNCTIONAL BLOCK DIAGRAM
2M x 16Bit x 4 Banks Synchronous DRAM
ORDERING INFORMATION
Part NO.
MAX Freq.
Interface Package
KM416S8030T-G/F8
125MHz
LVTTL
54pin
TSOP(II)
KM416S8030T-G/FH
100MHz
KM416S8030T-G/FL
100MHz
KM416S8030T-G/F10
100MHz
Samsung Electronics reserves the right to
change products or specification without
notice.
*
Bank Select
Data Input Register
2M x 16
2M x 16
Column Decoder
Latency & Burst Length
Programming Register
LCKE
LRAS
LCBR
LWE
LDQM
CLK
CKE
CS
RAS
CAS
WE
LDQM
LWE
LDQM
DQi
CLK
ADD
LCAS
LWCBR
2M x 16
2M x 16
Timing Register
UDQM


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