SURFACE MOUNT LED LAMPS

Low Current Type (IF≦10mA) Mini-molded chip LEDs

SML-211 Series

(Typ.)

The recommended thickness of the screen mask

for soldering is between 100 and 200μm. The

hole size of the screen mask should be same as

the recommended land pattern or smaller.

2012

(0805)

2.0

×1.25

t=0.8

(mA)

Typ.

(V)

Typ.

(mcd)

Typ.

(nm)

λp

Typ.

(nm)

Min.

(

(mA)

(mA)

Max.

(

µA)

Tolerance:

±0.1

(V)

∆λ

Feeding direction

2

4

φ1.5

1.7

1.0

φ13

φ60

φ180

Package Size

（mm）

Tape Spacifications：T86〈3,000pcs／reel〉

Reel Spacifications

Yellow

Orange

Red

AlGaInP on GaAs

Transparent

Clear

100

4

Terminal

Cathode mark

2.0

＋0.2

0

1.4

1.2

Relative brightness (

%)

0

50

100

50

100

0

°

30

°

60

°

90

°

30

°

60

°

90

°

（Unit：mm）

Y’

X’

Part No.

Forward

voltage

Light wavelength

Reverse

current

Brightness

Resin Color

Peak

forward

current

（mA）

Part No.

Power

dissipation

（mW）

Forward

current

（mA）

Reverse

voltage

（V）

Operating

temperature

（

°C）

Stotage

temperature

（

°C）

Emitting

color

Peak Half-wave

590nm

611nm

630nm

SML-211YT

SML-211DT

SML-211UT

SML-211YT

SML-211DT

SML-211UT

SML-211YT

SML-211DT

SML-211UT

44

Yellow

Orange

Red

20

60

4

-30 to +85

-40 to +85

590

1.4

4

0.9

2.5

15

2

611

16

2

2

1.8

630

18

1.1