Aluminum Electrolytic Capacitor

Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use.

Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.

– EE20 –

2.4

Flow Soldering

(1) Don not immerse the capacitor body into the

solder bath as excessive internal pressure could

result.

(2) Observe proper soldering conditions (temperature,

time, etc.). Do not exceed the specified limits.

(3) Do not allow other parts or components to touch

the capacitor during soldering.

2.5

Reflow Soldering for Chip Capacitors

(1) For reflow, use a thermal conduction system such

as infrared radiation (IR) or hot blast. Vapor heat

transfer systems (VPS) are not recommended.

(2) Observe proper soldering conditions (temperature,

time, etc.). Do not exceed the specified limits.

(3) Reflow should be performed one time. Consult us

for additional reflow restrictions.

2.7 Capacitor Handling after Soldering

(1) Avoid movement of the capacitor after soldering

to prevent excessive stress on the leadwires

where they enter the seal.

(2) Do not use the capacitor as a handle when

moving the circuit board assembly.

(3) Avoid striking the capacitor after assembly to

prevent failure due to excessive shock.

2.8

Circuit Board Cleaning

(1) Circuit boards can be immersed or ultrasonically

cleaned using suitable cleaning solvents for up

to 5 minutes and up to 6 0

° C maxi m u m

temperatures. The boards should be thoroughly

rinsed and dried.

Recommended cleaning solvents include

Pine Alpha ST-100S, Sunelec B-12, DK Beclear

CW-5790, Aqua Cleaner 210SEP, Cold Cleaner

P3-375, Telpen Cleaner EC-7R, Clean-thru 750H,

Clean-thru 750L, Clean thru 710M, Techno

Cleaner 219, Techno Care FRW-17, Techno

Care FRW-1, Techno Care FRV-1, IPA (isopropyl

alcohol)

V The use of ozone depleting cleaning agents are

not recommended in the interest of protecting

the environment.

(2) Avoid using the following solvent groups unless

specifically allowed for in the specification;

q Halogenated cleaning solvents: except for solvent

resistant capacitor types, halogenated solvents

can p ermeate the seal and cause internal

capacitor corrosion and failure. For solvent

resistant capacitors, carefully follow the

temperature and time requirements of the

specificaion. 1-1-1 trichloroe thane should never

be used on any aluminium electrolytic capacitor.

q Alkali solvents: could attack and dissolve the

aluminum case.

q Petroleum based solvents: deterioration of the

rubber seal could result.

q Xylene: deterioration of the rubber seal could

result.

q Acetone: removal of the ink markings on the

vinyl sleeve could result.

Time in

200°C or more

250

200

150

100

50

120 (s)

5 (s)

Time

240

230

220

210

0

10

20

30

40

50

60

240

230

220

210

0

10

20

30

40

50

60

2.6 Other Soldering Considerations

Rapid temperature rises during the preheat

operation and resin bonding operation can cause

cracking of the capacitor vinyl sleeve. For heat

curing, do not exceed 150

°C for a maximum time of

2 minutes.

temperature in assuming quantitative production, by

sticking the thermo-couple to the capacitor upper

part with epoxy adhesives.

Peak

temperature

Chip capacitor reflow guaranteed condition

Time in 200

°C or more (s)

(

φ3 to 6.3φ)

Time in 200

°C or more (s)

(

φ8 to φ10)

160

°C

240

230

220

210

0

10

20

30

40

50

60

EB Series

Time in 200

°C or more (s)

(

φ10 to φ18)

Mar. 2005