NTMFS4708NT1G datasheet(1/5 Pages) ONSEMI

Part #	NTMFS4708NT1G

Description	Power MOSFET 30 V, 19 A, Single N-Channel, SOIC-8 FL

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Manufacturer	ONSEMI [ON Semiconductor]

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July, 2007 - Rev. 2

1

Publication Order Number:

NTMFS4708N/D

NTMFS4708N

Power MOSFET

30 V, 19 A, Single N-Channel, SOIC-8 FL

Features

• Fast Switching Times

• Low Gate Charge

• Low RDS(on)

• Low Inductance SOIC-8 Package

• These are Pb-Free Devices

Applications

• Notebooks, Graphics Cards

• DC-DC Converters

• Synchronous Rectification

MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)

Parameter

Symbol

Value

Unit

Drain-to-Source Voltage

VDSS

30

V

Gate-to-Source Voltage

VGS

±20

V

Continuous Drain Current

(Note 1)

Steady

State

TA = 25°C

ID

11.5

A

TA = 85°C

8.0

t

≤ 10 s TA = 25°C

19

Power Dissipation

(Note 1)

Steady

State

TA = 25°C

PD

2.2

W

t

≤ 10 s

6.25

Continuous Drain Current

(Note 2)

Steady

State

TA = 25°C

ID

7.8

A

TA = 85°C

5.6

Power Dissipation

(Note 2)

TA = 25°C

PD

1.0

W

Pulsed Drain Current

tp ≤ 10 ms

IDM

58

A

Operating Junction and Storage Temperature

TJ,

TSTG

-55 to

150

°C

Source Current (Body Diode)

IS

6.25

A

Single Pulse Drain-to-Source Avalanche

Energy. VDD = 25 V, VGS = 10 V, IPK = 7.0 A,

L = 10 mH, RG = 25 W

EAS

245

mJ

Lead Temperature for Soldering Purposes

(1/8” from case for 10 s)

TL

260

°C

THERMAL RESISTANCE MAXIMUM RATINGS

Parameter

Symbol

Value

Unit

Junction-to-Ambient – Steady State (Note 1)

RqJA

56.5

°C/W

Junction-to-Ambient – t

≤ 10 s (Note 1)

RqJA

20

Junction-to-Ambient – Steady State (Note 2)

RqJA

124

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Surface-mounted on FR4 board using 1 in sq pad size

(Cu area = 1.127 in sq [1 oz] including traces).

2. Surface-mounted on FR4 board using the minimum recommended pad size

(Cu area = 0.412 in sq).

http://onsemi.com

Device

Package

Shipping†

ORDERING INFORMATION

NTMFS4708NT1G SOIC-8 FL

(Pb-Free)

1500/T

ape & Reel

SOIC-8 FLAT LEAD

CASE 488AA

STYLE 1

MARKING DIAGRAM &

PIN ASSIGNMENT

1

4708N

= Specific Device Code

A

= Assembly Location

Y

= Year

WW

= Work Week

G

= Pb-Free Package

4708N

AYWW

G

S

N-Channel

D

S

G

30 V

10.1 m

W @ 4.5 V

7.3 m

W @ 10 V

RDS(on) Typ

19 A

ID Max

V(BR)DSS

S

G

D

NTMFS4708NT3G

5000/T

ape & Reel

SOIC-8 FL

(Pb-Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

(Note: Microdot may be in either location)

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