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NTD95N02RT4G Datasheet(PDF) 1 Page - ON Semiconductor

Part # NTD95N02RT4G
Description  Power MOSFET 95 Amps, 24 Volts N?묬hannel DPAK
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NTD95N02RT4G Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2006
July, 2006 − Rev. 3
1
Publication Order Number:
NTD95N02R/D
NTD95N02R
Power MOSFET
95 Amps, 24 Volts
N−Channel DPAK
Features
High Power and Current Handling Capability
Fast Switching Performance
Low RDS(on) to Minimize Conduction Loss
Low Gate Charge to Minimize Switching Losses
Pb−Free Packages are Available
Applications
CPU Motherboard Vcore Applications
High Frequency DC−DC Converters
Motor Drives
Bridge Circuits
MAXIMUM RATINGS (TJ = 25°C unless otherwise specified)
Parameter
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
24
V
Gate−to−Source Voltage
VGS
±20
V
Thermal Resistance, Junction−to−Case
Total Power Dissipation @ TA = 25°C
Drain Current –
− Continuous @ TA= 25°C, Limited by Package
− Continuous @ TA= 25°C, Limited by Wires
RqJC
PD
ID
ID
1.45
86
95
32
°C/W
W
A
A
Thermal Resistance, Junction−to− Ambient
(Note 1)
− Total Power Dissipation @ TA = 25°C
− Drain Current − Continuous @ TA= 25°C
RqJA
PD
ID
52
2.4
15.8
°C/W
W
A
Thermal Resistance, Junction−to−Ambient
(Note 2)
− Total Power Dissipation @ TA = 25°C
− Drain Current − Continuous @ TA= 25°C
RqJA
PD
ID
100
1.25
12
°C/W
W
A
Operating Junction and Storage Temperature
TJ,
TSTG
−55 to
150
°C
Continuous Source Current (Body Diode)
IS
45
A
Single Pulse Drain−to−Source Avalanche
Energy – (VDD = 25 V, VG = 10, IPK = 13 A,
L = 1 mH, RG= 25 W)
EAS
84
mJ
Lead Temperature for Soldering Purposes
(1/8 in from case for 10 seconds)
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
2. Surface mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.412 in sq).
http://onsemi.com
D
S
G
V(BR)DSS
RDS(ON) TYP
ID MAX*
24 V
4.5 m
W @ 10 V
95 A
5.9 m
W @ 4.5 V
*ID MAX in the product summary table is continuous
and steady at 25
°C.
MARKING DIAGRAMS
& PIN ASSIGNMENTS
Y
= Year
WW
= Work Week
T95N02R
= Device Code
G
= Pb−Free Package
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
ORDERING INFORMATION
1
Gate
3
Source
2
Drain
4
Drain
DPAK
CASE 369AA
(Surface Mount)
STYLE 2
1 2
3
4
1
Gate
3
Source
2
Drain
4
Drain
DPAK
CASE 369D
(Straight Lead)
STYLE 2
1
2
3
4


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