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SN74AUP1G08DCKRE4 Datasheet(PDF) 2 Page - Texas Instruments |
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SN74AUP1G08DCKRE4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 22 page AUP LVC AUP AUP LVC Static-Power Consumption ( µA) Dynamic-Power Consumption (pF) † Single, dual, and triple gates 3.3-V Logic† 3.3-V Logic† 0% 20% 40% 60% 80% 100% 0% 20% 40% 60% 80% 100% −0.5 0 0.5 1 1.5 2 2.5 3 3.5 0 5 10 15 20 25 30 35 40 45 Time − ns † AUP1G08 data at CL = 15 pF Output Input Switching Characteristics at 25 MHz† Y + A • B or Y + A ) B 1 2 4 A B Y SN74AUP1G08 SCES502J – NOVEMBER 2003 – REVISED MAY 2010 www.ti.com Figure 1. AUP – The Lowest-Power Family Figure 2. Excellent Signal Integrity This single 2-input positive-AND gate performs the Boolean function in positive logic. NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION(1) ORDERABLE TOP-SIDE TA PACKAGE(2) PART NUMBER MARKING(3) NanoStar™ – WCSP (DSBGA) Reel of 3000 SN74AUP1G08YFPR _ _ _HE_ 0.23-mm Large Bump – YFP (Pb-free) NanoStar™ – WCSP (DSBGA) Reel of 3000 SN74AUP1G08YZPR _ _ _HE_ 0.23-mm Large Bump – YZP (Pb-free) QFN – DRY Reel of 5000 SN74AUP1G08DRYR HE –40°C to 85°C uQFN – DSF Reel of 5000 SN74AUP1G08DSFR HE SOT (SOT-23) – DBV Reel of 3000 SN74AUP1G08DBVR H08_ SOT (SC-70) – DCK Reel of 3000 SN74AUP1G08DCKR HE_ SOT (SOT-553) – DRL Reel of 4000 SN74AUP1G08DRLR (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (3) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YFP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). FUNCTION TABLE INPUTS OUTPUT Y A B L L L L H L H L L H H H LOGIC DIAGRAM (POSITIVE LOGIC) 2 Submit Documentation Feedback Copyright © 2003–2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1G08 |
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