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74LVC1G3208DBVRG4 Datasheet(PDF) 1 Page - Texas Instruments |
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74LVC1G3208DBVRG4 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 16 page www.ti.com FEATURES 3 2 4 6 1 A C Y GND B DBV PACKAGE (TOP VIEW) YEP OR YZP PACKAGE (BOTTOM VIEW) DCK PACKAGE (TOP VIEW) 3 2 4 6 1 A C Y GND B A B C Y GND See mechanical drawings for dimensions. 1 4 2 3 6 VCC VCC 5 VCC 5 5 DESCRIPTION/ORDERING INFORMATION SN74LVC1G3208 SINGLE 3-INPUT POSITIVE OR-AND GATE SCES605A – SEPTEMBER 2004 – REVISED JUNE 2005 • Can Be Used in Three Combinations: • Available in the Texas Instruments – OR-AND Gate NanoStar™ and NanoFree™ Packages – OR Gate • Supports 5-V VCC Operation – AND Gate • Inputs Accept Voltages to 5.5 V • Ioff Supports Partial-Power-Down Mode • Max tpd of 5 ns at 3.3 V Operation • Low Power Consumption, 10- µA Max I CC • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • ±24-mA Output Drive at 3.3 V • ESD Protection Exceeds JESD 22 • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at the – 2000-V Human-Body Model (A114-A) Input – 200-V Machine Model (A115-A) (Vhys = 250 mV Typ @ 3.3 V) – 1000-V Charged-Device Model (C101) This device is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC1G3208 is a single 3-input positive OR-AND gate. It performs the Boolean function Y = (A + B) ⋅ C in positive logic. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoStar™ – WCSP (DSBGA) SN74LVC1G3208YEPR 0.23-mm Large Bump – YEP Reel of 3000 _ _ _ DD _ NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP SN74LVC1G3208YZPR (Pb-free) –40 °C to 85°C Reel of 3000 SN74LVC1G3208DBVR SOT (SOT-23) – DBV CDD_ Reel of 250 SN74LVC1G3208DBVT Reel of 3000 SN74LVC1G3208DCKR SOT (SC-70) – DCK DD_ Reel of 250 SN74LVC1G3208DCKT (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, ⋅ = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar, NanoFree are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2004–2005, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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