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NCV86604D50R2G Datasheet(PDF) 3 Page - ON Semiconductor |
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NCV86604D50R2G Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 14 page NCV8660 http://onsemi.com 3 ABSOLUTE MAXIMUM RATINGS Rating Symbol Min Max Unit Input Voltage (IN) VIN −0.3 40 V Input Current IIN −1.0 − mA Output Voltage (OUT) DC Transient, t < 10 s (Note 1) VOUT −0.3 −0.3 5.5 16 V Output Current (OUT) IOUT −1.0 Current Limited mA Storage Temperature Range TSTG −55 150 °C DT (Reset Delay Time Select) Voltage (Note 2) VDT −0.3 16 V DT (Reset Delay Time Select) Current (Note 2) IDT −1.0 1.0 mA RO (Reset Output) Voltage DC Transient, t < 10 s VRO −0.3 −0.3 5.5 16 V RO (Reset Output) Current IRO −1.0 1.0 mA ESD CAPABILITY ESD Capability, Human Body Model (Note 3) ESDHB −2.0 2.0 kV ESD Capability, Machine Model (Note 3) ESDMM −200 200 V ESD Capability, Charged Device Model (Note 3) ESDCDM −1.0 1.0 kV THERMAL RESISTANCE Junction−to−Case (Note 4) DPAK 5 RqJC 15 °C/W Junction−to−Ambient (Note 4) DPAK 5 RqJA 66 °C/W Junction−to−Tab (Note 4) DPAK 5 RqJT 4.0 °C/W Junction−to−Ambient (Note 4) SOIC−8 FUSED RqJA 104 °C/W Junction−to−Lead (pin 6) (Note 4) SOIC−8 FUSED RqJT 33 °C/W LEAD SOLDERING TEMPERATURE AND MSL Moisture Sensitivity Level DPAK 5 SOIC−8 FUSED MSL 1 3 − Lead Temperature Soldering: SMD style only, Reflow (Note 5) Pb−Free Part 60 − 150 sec above 217°C, 40 sec max at peak SLD − 265 peak °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The output voltage must not exceed the input voltage. 2. External resistor required to minimize current to less than 1 mA when the control voltage is above 16 V. 3. This device series incorporates ESD protection and is tested by the following methods: ESD HBM tested per AEC−Q100−002 (EIA/JESD22−A114) ESD MM tested per AEC−Q100−003 (EIA/JESD22−A115) ESD CDM tested per EIA/JESD22/C101, Field Induced Charge Model 4. Values represented typical steady−state thermal performance on 1 oz. copper FR4 PCB with 1 in2 copper area. 5. Per IPC / JEDEC J−STD−020C. OPERATING RANGE Pin Symbol, Parameter Symbol Min Max Unit VIN, Input Voltage Operating Range VIN 4.5 40 V Junction Temperature Range TJ −40 150 °C |
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