NCV8570

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11

PACKAGE DIMENSIONS

TSOP−5

CASE 483−02

ISSUE H

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES

LEAD FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS

OF BASE MATERIAL.

4. DIMENSIONS A AND B DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS, OR GATE

BURRS.

5. OPTIONAL CONSTRUCTION: AN

ADDITIONAL TRIMMED LEAD IS ALLOWED

IN THIS LOCATION. TRIMMED LEAD NOT TO

EXTEND MORE THAN 0.2 FROM BODY.

DIM

MIN

MAX

MILLIMETERS

A

3.00 BSC

B

1.50 BSC

C

0.90

1.10

D

0.25

0.50

G

0.95 BSC

H

0.01

0.10

J

0.10

0.26

K

0.20

0.60

L

1.25

1.55

M

0

10

S

2.50

3.00

12

3

54

S

A

G

L

B

D

H

C

J

__

0.7

0.028

1.0

0.039

mm

inches

SCALE 10:1

0.95

0.037

2.4

0.094

1.9

0.074

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.20

5X

C AB

T

0.10

2X

2X

T

0.20

NOTE 5

T

SEATING

PLANE

0.05

K

M

DETAIL Z

DETAIL Z