PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

SN74LVC4245ADBR

ACTIVE

SSOP

DB

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC4245ADBRE4

ACTIVE

SSOP

DB

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC4245ADBRG4

ACTIVE

SSOP

DB

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC4245ADW

ACTIVE

SOIC

DW

24

25

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC4245ADWE4

ACTIVE

SOIC

DW

24

25

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC4245ADWG4

ACTIVE

SOIC

DW

24

25

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC4245ADWR

ACTIVE

SOIC

DW

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC4245ADWRE4

ACTIVE

SOIC

DW

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC4245ADWRG4

ACTIVE

SOIC

DW

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC4245APW

ACTIVE

TSSOP

PW

24

60

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC4245APWE4

ACTIVE

TSSOP

PW

24

60

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC4245APWG4

ACTIVE

TSSOP

PW

24

60

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC4245APWR

ACTIVE

TSSOP

PW

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC4245APWRE4

ACTIVE

TSSOP

PW

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC4245APWRG4

ACTIVE

TSSOP

PW

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC4245APWT

ACTIVE

TSSOP

PW

24

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC4245APWTE4

ACTIVE

TSSOP

PW

24

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC4245APWTG4

ACTIVE

TSSOP

PW

24

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

PACKAGE OPTION ADDENDUM

www.ti.com

18-Sep-2008

Addendum-Page 1