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NCV7321D11R2G Datasheet(PDF) 3 Page - ON Semiconductor

Part # NCV7321D11R2G
Description  Stand Alone LIN Transceiver
Download  12 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCV7321D11R2G Datasheet(HTML) 3 Page - ON Semiconductor

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NCV7321
http://onsemi.com
3
TYPICAL APPLICATION
GND
8
3
6
1
2
4
5
7
VBB
INH
LIN
WAKE
RxD
TxD
EN
GND
VCC
bat
3.3/5V
VBAT
LIN
WAKE
GND
KL30
LIN−
BUS
KL31
ECU
PD20070503.1
Figure 2. Typical Application Diagram for a Master Node
Table 2. PIN DESCRIPTION
Pin
Name
Description
1
RxD
Receive Data Output; Low in Dominant State; Open−Drain Output
2
EN
Enable Input, Transceiver in Normal Operation Mode when High, Pulldown Resistor to GND
3
WAKE
High Voltage Digital Input Pin to Apply Local Wakeup, Sensitive to Falling Edge, Pullup Current Source to VBB
4
TxD
Transmit Data Input, Low for Dominant State, Pulldown to GND (Switchable Strength for Wakeup Source Recognition)
5
GND
Ground
6
LIN
LIN Bus Output/Input
7
VBB
Battery Supply Input
8
INH
Inhibit Output, Switch Between INH and VBB can be Used to Control External Regulator or Pullup Resistor on LIN Bus
Table 3. ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min
Typ
Max
Unit
VBB
Voltage on Pin VBB
−0.3
+45
V
VLIN
LIN Bus Voltage
−45
+45
V
VWAKE
DC Voltage on WAKE Pin
−35
+45
V
VINH
DC Voltage on INH Pin
−0.3
VBB + 0.3
V
V_Dig_IO
DC Input Voltage on Pins (EN, RxD, TxD
−0.3
+45
V
TJ
Maximum Junction Temperature
−40
+150
°C
VESD
HBM (All Pins) (Note 4)
−4
+4
kV
CDM (All Pins) (Note 5)
−750
+750
V
Version NCV7321D10:
HBM (LIN, INH, VBB, WAKE) (Note 6)
System HBM (LIN, VBB, WAKE) (Note 7)
−5
−5
+5
+5
kV
kV
Version NCV7321D11:
HBM (LIN, INH, VBB, WAKE) (Note 6)
System HBM (VBB, WAKE) (Note 8)
System HBM (LIN) (Note 8)
−8
−7
−13
+8
+7
+13
kV
kV
kV
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
4. Equivalent to discharging a 100 pF capacitor through a 1.5 kW resistor conform to MIL STD 883 method 3015.7.
5. Charged device model test according to ESD STM5.3.1−1999.
6. Equivalent to discharging a 100 pF capacitor through a 1.5 kW resistor referenced to GND.
7. Equivalent to discharging a 150 pF capacitor through a 330 W resistor. 220 nF filter on LIN pin. System HBM levels are verified by an external
test−house.
8. Equivalent to discharging a 150 pF capacitor through a 330 W resistor. No filter on LIN pin. System HBM levels are verified by an external
test−house.


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