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SN74LVC2G14DCKRG4 Datasheet(PDF) 1 Page - Texas Instruments |
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SN74LVC2G14DCKRG4 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 15 page www.ti.com FEATURES 3 2 4 6 1 1A 1Y 2Y GND 2A DBV PACKAGE (TOP VIEW) YZP PACKAGE (BOTTOM VIEW) DCK PACKAGE (TOP VIEW) 3 2 4 6 1 1A 1Y 2Y GND 2A 1A 2A 1Y 2Y GND See mechanical drawings for dimensions. 1 4 2 3 6 VCC VCC 5 VCC 5 5 DESCRIPTION/ORDERING INFORMATION SN74LVC2G14 DUAL SCHMITT-TRIGGER INVERTER SCES200L – APRIL 1999 – REVISED JANUARY 2007 • Available in the Texas Instruments • Typical V OHV (Output VOH Undershoot) NanoFree™ Package >2 V at V CC = 3.3 V, TA = 25°C • Supports 5-V V CC Operation • I off Feature Supports Partial-Power-Down Mode Operation • Inputs Accept Voltages to 5.5 V • Latch-Up Performance Exceeds 100 mA Per • Max t pd of 5.4 ns at 3.3 V JESD 78, Class II • Low Power Consumption, 10-µA Max I CC • ESD Protection Exceeds JESD 22 • ±24-mA Output Drive at 3.3 V – 2000-V Human-Body Model (A114-A) • Typical V OLP (Output Ground Bounce) – 1000-V Charged-Device Model (C101) <0.8 V at V CC = 3.3 V, TA = 25°C This dual Schmitt-trigger inverter is designed for 1.65-V to 5.5-V VCC operation. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. The SN74LVC2G14 contains two inverters and performs the Boolean function Y = A. The device functions as two independent inverters, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoFree™ – WCSP (DSBGA) Reel of 3000 SN74LVC2G14YZPR _ _ _CF_ 0.23-mm Large Bump – YZP (Pb-free) Reel of 3000 SN74LVC2G14DBVR SOT (SOT-23) – DBV C14_ –40°C to 85°C Reel of 250 SN74LVC2G14DBVT Reel of 3000 SN74LVC2G14DCKR SOT (SC-70) – DCK CF_ Reel of 250 SN74LVC2G14DCKT (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 1999–2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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