www.ti.com

FEATURES

DESCRIPTION/ORDERING INFORMATION

SN74LVC1G11

SINGLE 3-INPUT POSITIVE-AND GATE

SCES487D – SEPTEMBER 2003 – REVISED JANUARY 2007

• Available in the Texas Instruments

Operation

NanoFree™ Package

• Latch-Up Performance Exceeds 100 mA Per

• Supports 5-V V

JESD 78, Class II

• Inputs Accept Voltages to 5.5 V

• ESD Protection Exceeds JESD 22

• Max t

–

2000-V Human-Body Model (A114-A)

• Low Power Consumption, 10-µA Max I

CC

–

200-V Machine Model (A115-A)

• ±24-mA Output Drive at 3.3 V

–

1000-V Charged-Device Model (C101)

• I

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

Reel of 3000

SN74LVC1G11YZPR

_ _ _C3_

0.23-mm Large Bump – YZP (Pb-free)

–40°C to 85°C

SOT (SOT-23) – DBV

Reel of 3000

SN74LVC1G11DBVR

C11_

SOT (SC-70) – DCK

Reel of 3000

SN74LVC1G11DCKR

C3_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2003–2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.