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* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25 mm 2 THRU BZT52C43 500 mW Zener Diode 2.4 to 43 Volts Features Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose Medium Current Ideally Suited for Automated Assembly Processes Absolute Maximum Ratings Symbol Rating Rating Unit PD Power dissipation 500 mW TJ Junction Temperature -65 to +1 50 TSTG Storage Temperature Range -65 to +1 50 Absolute Maximum Ratings Symbol Rating Rating Unit RthJA Thermal Resistance Junction to Ambient* 250 /W Electrical Characteristics Symbol Rating Rating Unit VF Maximum Forward Voltage (IF=10mAdc) 0.9 V BZT52C2V4 Revision: 10 20 10/03/01 DIMENSIONS INCHES MM DIM MIN MAX MIN MAX NOTE A .140 .152 3.55 3.85 B .100 .112 2.55 2.85 C .055 .071 1.40 1.80 D ----- .053 ----- 1.35 E .012 .031 0.30 .78 G .006 ----- 0.15 ----- H ----- .01 ----- .25 J ----- .006 ----- .15 A B E C J D H G SOD123 0.036” 0.093" 0.048” SUGGESTED SOLDER PAD LAYOUT M C C omponents 20736 Marilla Street Chatsworth !"# $% !"# TM Micro Commercial Components Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 and MSL Rating 1 www.mccsemi.com 1 of 3 • Lead Free Finish/RoHS Compliant("P" Suffix designates RoHS Compliant. See ordering information) |
