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ELJPA270KF Datasheet(PDF) 1 Page - Panasonic Semiconductor |
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ELJPA270KF Datasheet(HTML) 1 Page - Panasonic Semiconductor |
1 / 7 page Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Fixed Inductors (Chip Inductors) E 1 L 2 J 3 P 4 A 5 1 6 R 7 5 8 K 9 F 10 F 11 PF PE PC PA PB 1005 (0402) 1608 (0603) 2520 (1008) 3225 (1210) 4532 (1812) 1.5 nH 10 nH 220 nH 3.3 µH 47 µH 560 µH 1N5 10N R22 3R3 470 561 ±0.3 nH ±5% ±10 % ±20 % D J K M Taping Chip Inductors Product code Shape Size : mm (inch) Inductance Inductance tolerance Packaging Design No. 4. High Power Type PF, PE, PC, PA, PB ■ Features ● Low DCR and large current capability, suitable for power circuitry. ● Wire wound, resin molded chip inductor. (PC, PA, PB types) ● Unique Ceramic Core/Laser-cut technology (PF, PE type) ● Capable of being Re-flow or flow soldered. ● Wide line-up from 1005 to 4532 case sizes. ● Good for mounting. ■ Recommended Applications ● AV equipment, Wireless communication equipment and various types of general electronic equipment. ■ Explanation of Part Numbers ■Storage Conditions ● Package : Normal temperature (–5 to 35 °C), normal humidity (85 %RH max.), shall not be exposed to direct sunlight and harmful gases and care should be taken so as not to cause dew. ● Operating Temperature : –20 to +85 °C ■Storage Period ● Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation of tin-plated terminals. Even if storage conditions are within specified limits, solderability may be reduced with the passage of time. Therefore, please control the storage conditions and try to use the product within 6 months of receipt. ■Packaging Refer 27 and 28 page. ■Soldering Conditions Refer 29 page. ■Safety Precautions Refer 30 page. Jul. 2008 |
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