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ADS5484 Datasheet(PDF) 3 Page - Texas Instruments |
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ADS5484 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 37 page ADS5484 ADS5485 www.ti.com ............................................................................................................................................... SLAS610C – AUGUST 2008 – REVISED OCTOBER 2009 ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. ADS5484, ADS5485 UNIT AVDD5 to GND 6 V Supply voltage AVDD3 to GND 5 V DVDD3 to GND 5 V AC signal. Valid when AVDD5 is within normal operating range. When AVDD5 is off, analog inputs should be < 0.5 V. If not, the protection Analog input to GND diode between the inputs and AVDD5 becomes forward-biased and –0.3 to (AVDD5 + 0.3) V could be damaged or shorten device lifetime (see Figure 30). Short transient conditions during power on/off are not a concern. Analog INP to INM DC signal ±4 V Valid when AVDD3 is within normal operating range. When AVDD3 is off, clock inputs should be < 0.5 V. If not, the protection diode between Clock input to GND the inputs and AVDD3 becomes forward-biased and could be –0.3 to (AVDD3 + 0.3) V damaged or shorten device lifetime (see Figure 37). Short transient conditions during power on/off are not a concern. CLKP to CLKM ±2.5 V Digital data output to GND –0.3 to (DVDD3 + 0.3) V Digital data output plus-to-minus ±1 V Operating temperature range –40 to 85 °C Maximum junction temperature 150 °C Storage temperature range –65 to 150 °C ESD, human-body model (HBM) 2 kV (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. Kirkendall voidings and current density information for calculation of expected lifetime are available upon request. THERMAL CHARACTERISTICS (1) PARAMETER TEST CONDITIONS TYP UNIT Soldered thermal pad, no airflow 20 RθJA Soldered thermal pad, 150-LFM airflow 16 °C/W RθJC Thermal resistance from the junction to the package case (top) 7 RθJP Thermal resistance from the junction to the thermal pad (bottom) 0.2 (1) Using 49 thermal vias ( 7 × 7 array). See PowerPAD Package in the Application Information section. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): ADS5484 ADS5485 |
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Similar Description - ADS5484_2 |
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