NCP3012

http://onsemi.com

4

Rating

Symbol

Unit

High Side Drive Boost Pin

BST

45

−0.3

V

13.2

−0.3

V

COMP

COMP

5.5

−0.3

V

Enable

EN

5.5

−0.3

V

Feedback

FB

5.5

−0.3

V

High−Side Driver Output

HSDR

40

−0.3

V

Low−Side Driver Output

LSDR

13.2

−0.3

V

Power Good

PG

5.5

−0.3

V

Synchronization

SYNC

5.5

−0.3

V

Main Supply Voltage Input

40

−0.3

V

External Reference

VREF

5.5

−0.3

V

Switch Node Voltage

40

−0.6

V

Maximum Average Current

REF

EN

SYNC

PG

130

7.1

2.5

11

4

mA

Operating Junction Temperature Range (Note 1)

−40 to +140

°C

Maximum Junction Temperature

+150

°C

Storage Temperature Range

−55 to +150

°C

Thermal Characteristics (Note 2)

TSSOP−14 Plastic Package

Thermal Resistance Junction−to−Air

190

°C/W

Lead Temperature Soldering (10 sec): Reflow (SMD styles only) Pb−Free

(Note 3)

260 Peak

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. The maximum package power dissipation limit must not be exceeded.

2. When mounted on minimum recommended FR−4 or G−10 board

3. 60−180 seconds minimum above 237°C.