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MMZ1608S221A Datasheet(PDF) 1 Page - TDK Electronics |
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MMZ1608S221A Datasheet(HTML) 1 Page - TDK Electronics |
1 / 8 page (1/8) 012-01 / 20100324 / e9412_mmz1608.fm • All specifications are subject to change without notice. Chip Beads(SMD) For Signal Line MMZ Series MMZ1608 Type FEATURES • Chip bead(impeder), MMZ series offers 7 construction materials. • Size standardized for use by automatic assembly equipment. No preferred orientation. • Either flow or reflow soldering methods can be used due to electroplating of the terminal electrodes. • High reliability due to an entirely monolithic structure. • Closed magnetic circuit structure allows high-density installation while preventing crosstalk between circuits. • Low DC resistance structure of electrode prevents wasteful electric power consumption. • The products contain no lead and also support lead-free soldering. • It is a product conforming to RoHS directive. APPLICATIONS Removal of signal line noises of cellular phones, PCs, note PCs, TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game machines, digital photo frames, car navigation system, PNDs, etc. PRODUCT IDENTIFICATION (1) Series name (2) Dimensions L ×W (3) Material code (4) Nominal impedance 121:120 Ω at 100MHz (5) Characteristic type (6) Packaging style T:Taping HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheat- ing temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed cir- cuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN TEMPERATURE RANGES PACKAGING STYLE AND QUANTITIES RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING Conformity to RoHS Directive MMZ 1608 R 121 A T (1) (2) (3) (4) (5) (6) Operating/storage –55 to +125°C Packaging style Quantity Taping 4000 pieces/reel 0.3 ±0.2 1.6 ±0.15 0.8 0.6 0.6 Dimensions in mm Thickness(T) Weight 0.6 ±0.15mm 0.8 ±0.15mm 3mg 4mg Natural cooling 10s max. Preheating 60 to 120s Soldering 30 to 60s 230˚C 250 to 260˚C 180˚C 150˚C Time(s) • Please contact our Sales office when your application are considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. |
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