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MAX809SQ232T1G Datasheet(PDF) 3 Page - ON Semiconductor |
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MAX809SQ232T1G Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 13 page MAX809 Series, MAX810 Series http://onsemi.com 3 PIN DESCRIPTION Pin No. Symbol Description 1 GND Ground 2 RESET (MAX809) RESET output remains low while VCC is below the reset voltage threshold, and for a reset timeout period after VCC rises above reset threshold 2 RESET (MAX810) RESET output remains high while VCC is below the reset voltage threshold, and for a reset timeout period after VCC rises above reset threshold 3 VCC Supply Voltage (Typ) ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Power Supply Voltage (VCC to GND) VCC −0.3 to 6.0 V RESET Output Voltage (CMOS) −0.3 to (VCC + 0.3) V Input Current, VCC 20 mA Output Current, RESET 20 mA dV/dt (VCC) 100 V/msec Thermal Resistance, Junction−to−Air (Note 1) SOT−23 SC−70 RqJA 301 314 °C/W Operating Junction Temperature Range TJ −40 to +105 °C Storage Temperature Range Tstg −65 to +150 °C Lead Temperature (Soldering, 10 Seconds) Tsol +260 °C ESD Protection Human Body Model (HBM): Following Specification JESD22−A114 Machine Model (MM): Following Specification JESD22−A115 2000 200 V Latchup Current Maximum Rating: Following Specification JESD78 Class II Positive Negative ILatchup 200 200 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This based on a 35x35x1.6mm FR4 PCB with 10mm2 of 1 oz copper traces under natural convention conditions and a single component characterization. 2. The maximum package power dissipation limit must not be exceeded. PD + TJ(max) * TA RqJA with TJ(max) = 150°C |
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